Packaging Glass Wafers

In order to meet the diverse needs of our clients, YEK Glass's unique solution enables complex shapes that have been difficult to realize until now with high precision.

We are able to develop and process glass wafers in-house by combining our mold fabrication techniques with our innovative glass molding processes. Utilizing this technology, we can create structures which are considered difficult with conventional glass structuring techniques, such as complex shapes and precise sidewall angles. Challenging structures, such as triangles, can be structured as via holes or cavities. In addition, our thermoforming technology can accurately control the angle of the sidewalls of the via holes and cavities, making it possible to design in ways that were difficult with conventional processes (including laser ablation, ultrasonic cutting, chemical etching, and etc).

Packaging wafers are glass substrates with fine through holes for packaging semiconductor devices. Featuring excellent heat resistance, mechanical resistance, chemical resistance and water resistance, it is a great match for wafer level packaging.

Application

MEMS and sensor components, gyroscope components, LED packaging

Standard Production Spec

Hermeticity and encapsulation are important in semiconductor device packaging. The hermeticity of semiconductor packaging is maintained by glass’ inherent properties, but the shape of glass is not only flat. Glass substrates with various shapes such as concave or convex shapes as well as through holes or combinations thereof are required. Glass is difficult to structure, so the yield can be low and high-precision products tend to be cost prohibitive. Our company's unique technology, package wafer utilizing precision glass molding has many advantages that cannot be found in other processing methods. Not only can through holes be precisely arranged, but also concave and convex shapes can be accommodated. Glass component designs are flexible. Our glass components also have ideal properties contributing to the prevention of yield degradation due to defects in sealing or losses during dicing and cutting. In addition, with precision glass molding, packaging wafers with these advantages can be produced in large quantities at low cost. Our precision glass molding technology is instrumental in manufacturing high-quality semiconductor devices.

Precision Processing

Small hole diameter (φ0.2mm) and short pitch (0.5mm) are available.

Produce Vias & Cavities

Various shapes such as through holes, cavities, and stepped through holes can be manufactured.

Superior electrical properties

Low electrical loss and high electrical signal transmission due to glass insulation.

Rigid Packaging

Robust packaging is possible due to its high shape stability.

Wide range of applications

With over 40 years of accumulated glass molding technology, we realize designs that were impossible with machining.

Next Challenge

High-precision ultra-fine package wafer