Packaging Glass Wafer
Designed a glass substrate capable of wafer-level packaging (WLP) tailored to silicon wafers.
High-precision, low-cost, and high-end variety of features tailored to the user's specifications.
Application of Packaging wafer
As a glass pedestal with pressure sensor through holes
(Anodic junction with silicon)
As a glass pedestal with a cavity in a silicon chip
(Cavity in a silicon chip)
As a 3D packaging glass substrate that can be laminated
(Structurable 3D packaging)
Packaging Wafer specification
We can implement various shapes according to customer requests.
:: Specifications ::
| A(Hole Diameter) | φ200μm～(±50μm) |
| B(Hole Taper) | 2°～ |
| C(Hole Pitch) | 550μｍ～(±50μm) |
| D(Cavity Diameter) | φ250μm～ |
| E(Cavity Depth) | 350μm～ |
| F(Cavity Taper) | 20°～ |
| Glass Material | Soda lime glass, Borosilicate glass, Optical glass |
Ensure strict product quality in accordance with SEMI standards.
We also respond to various customer requests.
| SPEC | 4inch | 5inch | 6inch | 8inch | 12inch |
| Diameter | 100±0.20mm | 125±0.20mm | 150±0.20mm | 100±0.20mm | 100±0.20mm |
| Edge | C0.1 (+0.1mm/-0.05mm) | ||||
| Thickness | User Specifications | ||||
| Total Thickness Variation(TTV) |
< 10μm | ||||
| Waviness | < 40μm | < 40μm | < 60μm | < 65μm | unspecified |
| Strain | < 40μm | < 40μm | < 60μm | < 75μm | < 100μm |
| Surface | Single Side Polishing, Double Side Polishing | ||||
| Notch | Possibility | ||||
| Other | Laser imprinting on wafer surface | ||||